High Density Isostatic Graphite Semiconductor And Electronics Manufacturing
High Density Isostatic Graphite Semiconductor And Electronics Manufacturing
Basic Properties
Place of Origin:
China
Brand Name:
Fangda
Certification:
Iso9001
Trading Properties
Minimum Order Quantity:
1 piece
Product Summary
Grade Bulk Density (g/cm³) Electric Resistivity (μΩ⋅m) Compressive Strength (MPa) Flexural Strength (MPa) Shore Hardness Ash Content (ppm) Thermal Expansion (*10⁻⁶/°C) Thermal Conductivity W/(m⋅K) Young's Modulus (GPa) Applications CDI-S1 1.8 12.5 90 45 58 5 4.5 105 10 Semiconductor CDI-S20 1.8 10 ...
Product Custom Attributes
Highlight
High Density Isostatic Graphite
,Isostatic Graphite Semiconductor
,Electronics Manufacturing Isostatic Graphite
Material:
Isostatic Graphite
Color:
Black
Shape:
Solid Block
Product Description
Detailed Specifications & Features
| Grade | Bulk Density (g/cm³) | Electric Resistivity (μΩ⋅m) | Compressive Strength (MPa) | Flexural Strength (MPa) | Shore Hardness | Ash Content (ppm) | Thermal Expansion (*10⁻⁶/°C) | Thermal Conductivity W/(m⋅K) | Young's Modulus (GPa) | Applications |
|---|---|---|---|---|---|---|---|---|---|---|
| CDI-S1 | 1.8 | 12.5 | 90 | 45 | 58 | 5 | 4.5 | 105 | 10 | Semiconductor |
| CDI-S20 | 1.8 | 10 | 75 | 43 | 50 | 5 | 4.3 | 140 | 9 | Semiconductor |
| CDI-S3 | 1.78 | 11 | 85 | 40 | 45 | 5 | 3.8 | 120 | 10 | Semiconductor |
High Density Isostatic Graphite for Semiconductor and Electronics Manufacturing
High Density Isostatic Graphite is a premium carbon material engineered for demanding semiconductor and electronics manufacturing environments. Produced through advanced isostatic pressing technology, this graphite features a highly uniform microstructure, ensuring consistent physical and electrical properties in all directions.
Material Characteristics
The high density and fine grain size make this graphite ideal for precision components used in wafer processing, crystal growth, and thermal management systems. This material exhibits excellent thermal conductivity and outstanding resistance to thermal shock, allowing reliable performance under rapid heating and cooling cycles.
Technical Advantages
- Low thermal expansion coefficient minimizes deformation at elevated temperatures
- High purity level reduces contamination risks during sensitive manufacturing processes
- Superior mechanical strength compared to conventional graphite grades
- Excellent machinability supports tight tolerances and smooth surface finishes
- Enables production of thin-walled or complex-shaped components without compromising durability
Primary Applications
Typical applications include semiconductor furnace components, wafer carriers, susceptors, heaters, and fixtures used in LED and photovoltaic cell production. The material is also widely applied in electronic sintering equipment and high-temperature vacuum environments.
Operational Benefits
Key advantages include long service life, stable performance under extreme thermal conditions, and reduced maintenance costs. By choosing this isostatic graphite grade, manufacturers can improve process efficiency, product yield, and overall operational reliability in advanced electronics production lines.
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